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Test Criteria Of Thermal Shock Test Chamber

Thermal shock test chamber with uniform thermal stress performances,it has been developed to meet major International standards for thermal shock testing. applications in the field of research, development, inspection, and production.Meeting International StandardsTSD chamber achieves various tests from major international standards such as MIL, IEC, JIS.

Compatible test standards:

IEC 60749-25 : Semiconductor devices – Temperature cycling
IEC 60068-2-14 Na : Environmental testing – Change of temperature
IEC 61747-5 Na : Liquid crystal and solid-state display devices – Environmental, endurance and mechanical test methods
MIL-STD-883 : Military standard, microcircuits, test standards
IPC-TM-650 2.6.6 : Temperature cycling, printed wiring board
SAE J1879 : Handbook for robustness validation of semiconductor devices in automotive applications
JASO-D902 : Durability testing methods for automotive electronic equipment
EIAJ ED-4701 : Environmental and endurance test methods for semiconductor devices. (General)
EIAJ ED-4702 : Mechanical stress test methods for semiconductor surface mounting devices
EIAJ ED-7407 : Environmental and endurance test methods for CSP, BGA package on mounting condition

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